Octaveo - 3D Inspection

The Octaveo family of BGA Inspection Systems combines the power of pattern recognition with the power of precision metrology.

Structured lighting and highly optimised metrology algorithms provide blazing speed for detection of missing, deformed, or misaligned solder balls as well as isolation of individual ball height deviations from coplanarity.

A powerful scripting environment allows test engineers to customise production mode test sequences for individual styles and sizes of BGA chips as well as binning of the measurement results. We offer a variety of pricing options to satisfy the budget requirements of any manufacturing environment.

The Octaveo Model 152 is the latest addition to the family of chip-scale package (CSP) and ball grid array (BGA) inspection systems.

This new model 152 is equipped with stereo 2 megapixel cameras and macro-zoom lenses.

It can inspect solder balls from .2 to 1.3mm diameter on chips varying from 2mm to 25.4mm on a side.

The software can handle arrays up to 40 x 40 balls, with any number of depopulated-balls desired.

STV Inspection System

The STV system is a general purpose lead inspection system for all families of QFP, TSSOP, SO, etc devices.

It is specifically configured and applied to the 2D inspection of SMA/SMC devices from 2 sides.

The technology for lead coplanarity had been developed by STV since 1993, and today it is one of the standard methods for lead 2D measurement.

The mold inspection is based on specific illumination & imaging methodologies applied to enhance the mold edges.

This technology has been developed for leadframe inspection 10 years ago, and is now applied to the inspection of mold compound for voids.

The camera module has the universal adapter feature, to attach a variety of different modules for various package types.

A quick release system with one screw only is used to fix the mirror module to the camera unit.

This way the system changeover to another device type for inspection is really easy.

And the modules have mechanical precision alignment pins or auto-alignment without recalibration after changeover.

Today, the complete backend process requires inspection not only of the lead coplanarity, the total job consist of three inspection stations:

• Marking inspection after the laser mark, and after electrical test
  
• Mold inspection outside the marking area
  
• Lead colinearity

Consequently, STV offers the complete system with 2 camera stations (2 vision systems), all integrated into one image processor, monitor and user interface.

• depressed wire loop
  
• bond shortage of wire at edge of pad/die
• partially lifted bonds

See the difference between good bond (left) and partially lifted one (right):