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VA offers highly reliable and low insertion force Test Contactors which utilize a variety of miniature double ended contact pins. Also offers a wide range of replaceable contact pin to meet your high frequency testing requirements. These are excellent for production testing of semiconductor devices. VA is committed to provide a comprehensive and well designed test contactor solution depending on client's requirements.
  • Using double ended spring loaded contacts
  • Offer different tip style for various applications
  • Minimized solder migration
  • Consistent contact resistance & spring force throughout life cycle
  • Customized to your unique need and requirement
  • Short lead time and competitive price
   FEATURES
  • Designed to fit Module.
  • Allows for easy insertion and removal of module for upgrade, replacement and repair.
  • Eliminates damage of valuable PCB's.
  • Perfect for high volume production applications and prototypes.
  • Good compliance between the device & contacts.
  • Uses a special surface mounting to your printed circuit board.
  • Special prototyping adapters designed on request allowing socket to be plugged into standard prototyping boards.
  • The Material socket body allows for device alignment with high wear resistance & low thermal coefficient of thermal expansion.
  • The socket body utilize coarse & fine alignment with tapered guides to ensure ease of entry.
APPLICATIONS
  • Hand-Test.
  • Prototyping.
  • Good electrical performance.
  • Qualification.
  • Development.
  • Device Stability.
  • Mass Production.
  • Future Upgrades.
  • Allocation Issues.
 
 


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FEATURES

Miniature double ended spring loaded contact pin.
     Minimize coplanarity of the balls on DUT.

Pitch:
     1.27 mm; 1.00 mm; 0.80 mm; 0.50 mm; 0.40 mm; 0.3 0mm

Short contact / short pin length.      Minimize capacitance, inductance and contact resistance.      Good electrical performance.      Best for high frequency / high speed testing i.e. RF-Devices.

Special Spring Design : “Barrel shape – ensure consistent contact.
Long life span : -> 300k in general, >500k insertions – BGA package at ambient temp.
Solder migration – minimal -> low Maintenance.
Wide range of pin sizes: Standard / custom made.

                		 


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Speed, Accuracy and Reliability

  • Very fast throughput
  • Very fast index time
  • Fast Tray PNP system and throughput not sort limited for typical devices
  • Enhanced first pass yield (vision alignment)
  • Simple, cheaper socket, vision aided socket inspection
  • Optional socket cleaner

Flexibility

  • 8 single JEDEC Tray Bins (user settable categories, float categories)
  • Small footprint
  • Vertical docking
  

Ergonomics

  • Size
  • Operator tray handling
  • Test site orientation
  • Socket location
  • Kit based changeover (change from single to 2, 4, 8, 16 sites via fixturing)

Cost Effective

  • low initial pricing
  • Low price fixturing
  • Kit based changeover
  • Simple Socket requiring no alignment features
 

Support

  • US and Pacific Rim expertise available
  • Internet enabled assistance (systems troubleshooting tools available via the internet) available via the internet)


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PLASTRONICS – OFFERS THE RIGHT BURN-IN SOCKET FOR EVERY TECHNOLOGY ROAD YOU TRAVEL!

Plastronics Socket Company has been offering its customers state-of-the–art Burn-in Sockets for more than 30 years. Plastronics continues to be committed to meeting its customers’ needs in quality, service and support.

  • Plastronics offers a full line of fine pitch BGA test and burn-in sockets and the latest selection of QFN sockets in the industry. Plastronics’ fine pitch BGA sockets are available in 0.50mm, 0.65mm, 0.75mm and 0.80mm pitch configurations. QFN sockets are available in lidded and open top styles in over 80 different JEDEC footprints. Both BGA and QFN sockets are now available with thermal management.
  • Plastronics has the new range of socket using Ultra Spring contacts for Dual-row QFN and .5mm – 1.27mm pitch LGA sockets. This Ultra Spring contact, originally created for high-speed testing that can handle up to 25GHz with a –1dB loss has been modified by Plastronics for burn-in testing to offer the smallest pure vertical contact ever made.
  • Plastronics also offers sockets for LCC, PLCC, SOP, TQFP, TSOP and BGA devices of 1.00mm, 1.27mm and 1.5mm pitch.


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DY Eltec Package Test Sockets are mainly for leaded packages, ie TSOP, SOIC, QFP and QFN. They also offer test socket for memory modules. Both sockets are using contact fingers type of contact pins that come in arry design.

The special features of the contact fingers are:-

  • Easy replaceable / assembly
  • Firm contact auto load board – no digging effect
  • Minimize solder migration
  • Very minimal of cleaning required
  • Longer life span


Wafer Bumping
 

Performs the following:-

  • Resistance: milli-ohm to Mega ohm
  • Current Leakage: 50nA min
  • Capacitance measurement
  • Diode voltage in forward and reverse mode
  • Open short between pins
  • Average test time: 0.5msec


Wafer Bumping
 

The “No Foot-print” full functional mixed signal tester:-

  • Fast
  • Low Cost
  • No floor space
  • Easy upgrade
  • Low maintenance cost
  • Low Entry cost
  • Able to load with different modules to alter configuration for different tests
  • Can be configured to test ADC including sigma delta type, DAC, digital, opto, linear, high voltage / current devices
  • Test include open, short, leakage, DC parametric and AC parametric
  • Can be integrated to Trim Form handler for In Assembly Test


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RTI is the leading supplier of automated curve tracing to the semiconductor industry world wide. Failure analysis, reliability engineering, product development engineering and other product quality engineering labs all use curve tracing testing as a nondestructive test to objectively assess if electrical damage has occurred to the circuits (or pins) of a semiconductor IC devices. The MTForms software allows the user to create and save test configurations, compare results from previous tests and save the results to either .bmp or .jpg format. Standard Applications include unpowered curve tracing, powered curve tracing, supply current measurements and latch up testing but many more tests are possible when customizing test setups. A variety of models are available based on maximum pin count and desired testing.

 


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The MT Century test system is a lightweight way to provide non-destructive, electrical characterization of packages with up to 96 pins. Automated curve tracing allows for the quick setup and acquisition of curve trace data. Use the MT Century to confirm electical failure independant of more complex ATE resources. The MT Century family includes 4 models, designed to fit your budget and test requirements. These systems are compatible with existing RTI hardware. Upgrades are available within the Century family.